Global Technology Partners

  • Henkel Henkel
  • DOW DOW
  • 3M 3M
  • WEVO Chemical WEVO Chemical
  • NeoAd NeoAd
  • Molykote Molykote
  • ShinEtsu ShinEtsu
  • Tesa Tesa

Henkel is a global leader in adhesives, sealants, coatings, and surface treatments, delivering solutions that enable performance, reliability, and sustainability across diverse industries. Through trusted brands such as LOCTITE®, TEROSON®, TECHNOMELT®, BONDERITE®, and AQUENCE®, Henkel provides a comprehensive portfolio covering industrial bonding, sealing, coating, encapsulation, lubrication, thermal management, repair materials, and process solutions.

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DOWSIL™, the flagship silicone brand of Dow, delivers cutting-edge materials that drive innovation across mobility, electronics, energy, and industrial applications. From thermal management, conformal coatings, encapsulants, and adhesives to advanced solutions for e-mobility, aerospace, and 5G electronics, DOWSIL™ combines more than a century of expertise with a strong commitment to sustainability

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3M is a global leader in adhesives, tapes, and bonding solutions helping industries design lighter, stronger, and more reliable products. From electronics and automotive to energy and construction, 3M advanced materials enable precision assembly, durability, and performance, empowering innovation without compromise.

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WEVO Chemical Corporation is dedicated to providing high-quality materials to the North American market together with Wevo companies in Germany, China and Asia. For 80 years, WEVO Chemical have been developing customized polyurethane, epoxy, and silicone solutions. Used for potting, sealing and adhesive applications, WEVO Chemical reliably protect electronic components in a wide range of industries.

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NeoAd, Techniq’s proprietary brand, offers advanced accessories and adhesive solutions engineered for industrial excellence. Combining superior adhesion, durability, and reliability, NeoAd enables manufacturers to achieve consistent, long-lasting performance.

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MOLYKOTE® specialty lubricants provide proven solutions for the most demanding design and maintenance challenges. Backed by DuPont’s innovation and application expertise, MOLYKOTE® offers a full portfolio of anti-friction coatings, greases, oils, pastes, and dispersions engineered to ensure durability, efficiency, and reliability. Trusted worldwide, MOLYKOTE® helps industries optimize performance, extend equipment life, and simplify maintenance with tailored lubrication solutions for every critical application.

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Shin-Etsu delivers advanced silicone technologies designed for demanding industrial applications. From thermal management and electrical insulation to sealing, bonding, and protection, our materials ensure reliability, durability, and efficiency across electronics, automotive, and manufacturing industries.

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tesa® is a global leader in adhesive tape technologies, delivering high-performance bonding, mounting, insulation, protection, and sealing solutions for demanding industrial applications. From automotive and electronics to packaging and construction, tesa® tapes replace traditional fasteners with cleaner, more efficient, and durable alternatives. With decades of expertise and a commitment to innovation, tesa® enables manufacturers worldwide to optimize processes, enhance reliability, and achieve sustainable growth

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Application Areas

Electronics Assembly & Manufacture

Automotive & Transportation

Data & telecommunications - Optical

General Industries

Connecting Technologies. Local Expertise. Creating Value

Insights & Updates

LOCTITE ECCOBOND UF 9000AG-061 – Epoxy Underfill Encapsulant – Semiconductor Flip Chip Packaging for mobile, automotive, and high-performance computing applications

LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.

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BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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