• Item Name: CEMEDINE 1500
• Manufacturer: CEMEDINE CO., LTD.
• Technologies: Two-component epoxy resin adhesive (solventless, reactive)
• Color: Light yellow transparent (base resin), Light brown transparent (hardener)
• Cure Type: Room temperature curing, 1:1 mixing ratio
• Package Size: 500 g, 1 kg, 3 kg, 15 kg; small sets available
• Shelf Life: Contact to Techniq VN for details.
CEMEDINE 1500 is a two-part, room-temperature curing epoxy adhesive designed for high-performance bonding across a wide range of materials including metals and plastics. It is solventless, produces no gas during curing, exhibits excellent adhesive strength, heat and chemical resistance, minimal shrinkage, low creep under load, and superb insulation properties. This makes it suitable for industrial, automotive, electronic, construction, and precision equipment applications.
Bonding and assembly of vehicles, vessels, and aircraft components.
Adhesion and sealing of electrical and electronic equipment.
Bonding composite materials for construction or artworks.
Assembly of sporting equipment and precision devices.
Applications requiring high durability, heat resistance, and chemical resistance.
| Property | 1500 (Standard Type) |
|---|---|
| Type | Two-part epoxy adhesive |
| Base | Epoxy resin / Polyamide |
| Appearance | Light yellow transparent / Light brown transparent |
| Viscosity (Pa·s/23°C) | 20 / 55 |
| Density (g/cm³) | 1.16 / 0.97 |
| Mixing ratio | 1:1 |
| Standard curing | 23°C × 24h |
| Pot life | Within 1 hour |
| Time for effective curing | 6 hours |
| Tensile shear strength (MPa) | 15.7 |
| T-peel strength (N/mm) | 0.4 |
| Hardness (Shore D) | 82 |
| Glass transition point (°C) | 54 |
| Water absorption (%) | 0.8 |
| Coefficient of linear expansion | 7.1 × 10⁻⁵ |
| Volume resistivity (Ω·cm) | 7.1 × 10¹⁵ |
| Capacity | 500 g / 1 kg / 3 kg / 15 kg |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.