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Cemedine EP138 – One-part heat curing epoxy adhesive – Multi-purpose, high-viscosity non-sag type for diverse bonding applications

  • Item Name: EP138

  • Manufacturer: Cemedine Co., Ltd.

  • Technologies: One-part heat curing epoxy adhesive (multi-purpose type)

  • Color: Light yellowish brown

  • Cure Type: Heat curing (120 °C × 30 min or 150 °C × 20 min)

  • Package Size: 1 kg, 3 kg, 20 kg

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

CEMEDINE EP138 is a one-part, heat-curing epoxy adhesive designed for high-viscosity, non-sag applications. As a one-part system, it eliminates mixing errors and ensures consistent bonding performance. The EP138 model provides high peel and shear strength, excellent heat resistance, and durability under mechanical stress. This adhesive is suitable for multi-purpose industrial applications requiring strong, reliable bonds with thermal and electrical stability.


2. Applications

  • Bonding of metals, plastics, and composite materials in industrial and electronic applications.

  • Situations requiring high peel resistance and shear strength.

  • Applications with high-temperature exposure or thermal cycling.

  • Multi-purpose, flexible, or heat-resistant bonding where one-part heat curing is preferred.

  • Potting for electronic components (other EP series models: EP811 for flow-type applications).

3. Typical Properties

Property EP138 (Not Mixed) After Curing
Type One-part heat curing epoxy adhesive Same
Base Epoxy resin Same
Appearance Light yellowish brown Cured solid
Viscosity (Pa·s, 23°C) 240
Density (g/cm³) 1.4 Same
Standard Curing 120°C × 30 min / 150°C × 20 min Fully cured
Tensile Shear Strength (MPa) 25.6
T-Peel Strength (N/mm) 3.06
Hardness Shore D 88
Glass Transition Temperature (°C) 122
Water Absorption Ratio (%) 0.1
Linear Expansion Coefficient 5.7 ×10⁻⁵ /°C
Volume Resistivity (Ω·cm) 3.0 × 10¹⁵
Dielectric Constant (100Hz) 4.7
Dielectric Loss Tangent (100Hz) 0.01
Storage Temperature 0–10°C
Capacity 1 kg / 3 kg

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