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Cemedine EP811 – One-part heat curing epoxy adhesive – Potting electronics, flow type for high-performance encapsulation

  • Item Name: EP811

  • Manufacturer: Cemedine Co., Ltd.

  • Technologies: One-part heat curing epoxy adhesive (potting electronics type)

  • Color: Black

  • Cure Type: Heat curing (120 °C × 30 min)

  • Package Size: 4 kg, 10 kg

  • Shelf Life: Contact to Techniq VN for details

1. Product Overview

CEMEDINE EP811 is a one-part, heat-curing epoxy adhesive designed for potting and flow-type applications in electronics. It provides high mechanical strength, excellent thermal stability, and electrical insulation properties. The adhesive cures into a rigid, durable solid, offering strong peel and shear resistance suitable for components exposed to thermal and mechanical stress.


2. Applications

  • Potting and encapsulating electronic components.

  • Bonding metals, plastics, and composite materials in high-stress or high-temperature environments.

  • Applications requiring high tensile and breaking strength.

  • Situations where thermal cycling or dimensional stability is critical.

3. Typical Properties

Property EP811 (Not Mixed) After Curing
Type One-part heat curing epoxy adhesive Same
Base Epoxy resin Same
Appearance Black Cured rigid solid
Viscosity (Pa·s, 23°C) 82
Density (g/cm³) 1.71 Same
Standard Curing 120°C × 30 min Fully cured
Tensile Shear Strength (MPa) 19.7
T-Peel Strength (N/mm)
Hardness Shore D 91
Glass Transition Temperature (°C) 134
Elastic Modulus (MPa) 6600
Poisson’s Ratio 0.3
Breaking Strength (MPa) 59
Elongation at Break (%) 1.19
Water Absorption Ratio (%) 0.05
Linear Expansion Coefficient 25 ×10⁻⁵ /°C
Volume Resistivity (Ω·cm) 5.0 ×10¹⁵
Insulation Breakdown Voltage (kV/mm) ≥22
Dielectric Constant (100Hz) 5.2
Dielectric Loss Tangent (100Hz) 0.1
Capacity 4 kg / 10 kg

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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