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Chemtronics Chemask® LF – Lead-Free Solder Masking Agent – PCB Protection in High-Temperature Applications

Item Name: Chemtronics Chemask® LF (Product# CLF8)
Manufacturer: Chemtronics
Technologies: Peelable solder masking agent, natural latex rubber, lead-free formulation
Color: Pink
Cure Type: Fast curing, ambient temperature (tack-free 15 min, full cure 30 min @ 25°C)
Package Size: 8 fl. oz. / 236 mL liquid
Shelf Life: 2 years

1. Product Overview

Chemask® LF Lead-Free Solder Masking Agent is a temporary, peelable, high-viscosity compound designed specifically for high-temperature lead-free soldering applications. It withstands up to 550°F (288°C), cures quickly, and leaves no residue after removal. The product is compatible with all flux types and cleaning solvents, making it ideal for protecting sensitive PCB areas during wave soldering and conformal coating. It is RoHS compliant, non-flammable, and engineered for industrial electronic manufacturing environments.


2. Applications

  • Protecting component-free areas during soldering

  • Shielding components and sockets

  • Covering pin connectors during wave soldering

  • Safeguarding temperature-sensitive components

  • Suitable for both lead-free and Tin/Lead soldering processes

3. Typical Properties

Property Before Use / Unmixed After Cure / Mixed (if applicable)
Base Material Natural latex rubber Peelable cured mask
Color Pink Pink (peelable)
Solvent Stability Stable in hydrocarbon, HFC, chlorinated, halogenated solvents Maintains stability in solvents
Flux Compatibility All types Compatible with flux residues
Temperature Stability Up to 550°F (288°C)
Drying Time (Tack-Free) ~15 min @ 25°C (10 mils) Fully cured in ~30 min @ 25°C
Viscosity (@ 25°C) ~190,000 cps (±500) Solid peelable mask
Solids Content ~80%
Flash Point Nonflammable Nonflammable
Weight/Gallon ~7.2 lbs.
Shelf Life 2 years
Removal Peelable by hand/tweezers

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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