Item Number: SN100C
Manufacturer: Nihon Superior (marketed by AIM Solder)
Alloy/Composition: Sn balance, Cu 0.7%, Ni 0.05%, Ge 0.009%
Diameter/ Size Range: 1.1 kg (2.5 lb) triangular bars, 3 kg AIM Safety Bar
Flux Type/ Core: Compatible with all no-clean and water-soluble fluxes
Melting Temperature: 227°C (441°F) eutectic
Packaging: Contact to Techniq VN for details.
Shelf Life: 7 years at room temperature
1. Product Overview
SN100C® is a lead-free, silver-free solder alloy developed by Nihon Superior in Japan and widely adopted since 1999. It consists mainly of tin with controlled additions of copper, nickel, and germanium. The nickel stabilizes solder joints by reducing copper dissolution, while germanium lowers dross formation and enhances solder flow. This alloy produces smooth, bright, and bridge-free solder joints, with performance comparable to SAC alloys but at a significantly lower cost. It fully complies with IPC J-STD-006 standards.
2. Applications
SN100C is suitable for wave and selective soldering in diverse electronic manufacturing processes. It is compatible with all no-clean and water-soluble electronic-grade fluxes and available in bar, solid wire, cored wire, and solder paste forms. Its stable properties make it an economical and reliable alternative to silver-based alloys in commercial applications.
3. Typical Properties – Specifications
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