• Item Name: LOCTITE ECCOBOND UF 3812
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Black liquid
• Cure Type: Heat cure (>10 minutes @ 130°C)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 6 months
1. Product Overview
LOCTITE ECCOBOND UF 3812 is a halogen-free, one-component, reworkable epoxy underfill designed for CSP, WLCSP, and BGA packages. It features room-temperature flow without preheating, rapid curing at moderate temperatures, and strong thermal cycling reliability. With a high glass transition temperature (Tg) and excellent fracture toughness, it provides robust protection for solder joints under thermal stress. The material is compatible with most Pb-free solders and demonstrates stable electrical performance under thermal/humidity bias conditions.
2. Applications
This underfill is used for semiconductor packaging, particularly for CSP, WLCSP, and BGA devices. Its easy reworkability and excellent thermal cycling resistance make it suitable for high-reliability electronics where solder joint integrity is critical, including consumer electronics, telecommunications, and advanced computing devices.
3. Typical Properties
| Property | Uncured Material | Cured Material |
|---|---|---|
| Viscosity @ 25°C (1,000 s⁻¹) | 350 mPa·s | – |
| Specific Gravity | 1.23 | – |
| Pot Life @ 25°C | 3 days | – |
| Work Life @ 25°C | 1 day | – |
| Shelf Life @ -20°C | 180 days | – |
| Cure Schedule | >10 min @ 130°C | – |
| Glass Transition Temperature | – | 131 °C |
| CTE | – | 48 ppm/°C (below Tg); 175 ppm/°C (above Tg) |
| Storage Modulus @ 25°C | – | 3,004 MPa (435,580 psi) |
This product balances flowability, toughness, and reworkability, ensuring strong solder joint reliability and long-term performance in demanding electronic assemblies.
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