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Thermal Management

Araldite® DBF / Aradur® HY 951 – Epoxy Casting System – Potting & Encapsulation of Electronic Components

Item Name: Araldite® DBF Resin / Aradur® HY 951 Hardener
Manufacturer: Huntsman Advanced Materials
Technologies: Low-viscosity, unfilled epoxy casting resin system with aliphatic amine hardener
Color: Clear liquid (yellowish after cure)
Cure Type: Room temperature or 4 h at RT + 4 h at 60°C
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

Araldite® DBF / Aradur® HY 951 is a low-viscosity, unfilled epoxy casting resin system that cures at room temperature and allows for high filler addition. The system combines Araldite DBF, a plasticized epoxy resin, with Aradur HY 951, a low-viscosity aliphatic amine hardener. It offers excellent mechanical strength, high chemical and atmospheric resistance, and outstanding electrical insulation performance.


2. Applications

Designed for encapsulation and potting of low-voltage and electronic components, this system is ideal for casting or vacuum casting processes. It provides durable protection and electrical insulation for components exposed to heat, moisture, and chemical environments.

3. Typical Properties

Property Still Not Mixed (Resin / Hardener) After Mixed (Cured System)
Viscosity at 25°C (mPa·s) 1350–2000 / 10–20 850
Specific Gravity (g/cm³) 1.1–1.2 / 0.98 1.19
Appearance Clear liquid / Clear liquid Yellowish casting
Mix Ratio (pbw) Resin 100 / Hardener 10
Pot Life at 25°C (min) 93–135
Gel Time at 25°C (min) 160
Curing Cycle 24–48 h at RT or 4 h RT + 4 h at 60°C
Tensile Strength (MPa) 52
Elongation at Break (%) 11
Hardness (Shore D) 85
Glass Transition Temperature (°C) 67
Dielectric Strength (kV/mm) 25
Volume Resistivity (Ω·cm) 7 × 10¹⁵

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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