• Item Name: ARALDITE® CW 31000 / ARADUR® 3489
• Manufacturer: Huntsman
• Technologies: Epoxy & Epoxy Derivatives
• Color: Contact to Techniq VN for details.
• Cure Type: Heat Cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
ARALDITE® CW 31000 / ARADUR® 3489 is a prefilled, warm-curing epoxy casting resin system designed for electronic encapsulation and composite applications. The system exhibits excellent crack resistance, superior mechanical and electrical properties, and a long pot life, making it suitable for demanding industrial uses. It is typically processed via gravity casting and cured by heat to form a durable, stable polymer matrix.
This resin system is used in manufacturing inductor components, instrument transformers, tools, and windmill blades. It is also ideal for coils and inductivities such as MRI gradient coils and other high-performance electrical casting systems. Its ability to maintain performance under thermal and mechanical stress ensures long-term reliability in electrical and industrial components.
| Property | Test Method / Condition | Unit | Value (Unmixed or Mixed) |
|---|---|---|---|
| Mix Ratio (Hardener:Resin) | Internal | % (W) | 0.12 |
| Pot Life | At 25°C | h | 4–6 |
| Gelation Time | 30°C | h | 2 |
| Cure Schedule | 6 h at 50°C + 6 h at 70°C | – | Heat Cure |
| Linear Shrinkage (after cure) | 12h 30°C + 6h 70°C | % | 0.15 |
| Tensile Strength | ISO R527 | N/mm² | 65–70 |
| Elongation at Break | ISO R527 | % | 19–21 |
| Flexural Strength | ISO 178 | MPa | 110–115 |
| Glass Transition Temperature (Tg) | ISO 11357-2 | °C | 72–76 |
| Thermal Conductivity | ISO 8894-1 | W/mK | 0.61–0.63 |
| Dielectric Strength | IEC 60243-1 | kV/mm | 50–55 |
| Tracking Resistance | IEC 60112 | CTI | >600 (Solution A) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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