LOCTITE® SI 5033™ is a one-component, thixotropic acetoxy dual-cure silicone adhesive. It cures via UV/visible light with a secondary moisture cure for shadowed areas. The product is non-sagging, self-supporting, and capable of deep light cure. Upon curing, it forms a high-strength, flexible rubber suitable for gasketing, sealing, bonding, and encapsulating applications. Functional strength develops almost instantly, with full performance achieved over 72 hours at ambient conditions.
Encapsulation of electronic, automotive, and industrial components
Gasketing and sealing of assemblies requiring flexible, high-strength silicone
Bonding and sealing in areas with limited light exposure (shadow curing)
Applications requiring reduced migration due to thixotropic behavior
| Property | Uncured | Cured | Unit | Test Method |
|---|---|---|---|---|
| Appearance | Light yellow, translucent paste | – | – | Visual |
| Specific Gravity @ 25°C | 1.09 | – | – | – |
| Solids / Non-Volatile Content | 95.7 | – | % | – |
| Flow (ISO 7390) | 2.5 | – | mm | ISO 7390 |
| Extrusion Rate | 100–170 | – | g/min | Semco #440 nozzle, 0.6 MPa, 15 s, 25°C |
| Skin Over Time | – | ≤15 | min | 23°C / 50% RH |
| Tack Free Time | – | ≤20 | sec | ASTM C679, 70 mW/cm², 365 nm |
| Depth of Cure (UV/Visible, 60 s) | – | ≥10 | mm | 70 mW/cm², 365 nm |
| Shore Hardness | – | 45–65 | Durometer A | ISO 868 |
| Elongation at Break | – | ≥150 | % | ISO 37 |
| Tensile Strength | – | ≥2.75 | N/mm² (≥398 psi) | ISO 37 |
| Tear Strength | – | 14.0 | N/mm (79.9 lb/in) | ISO 34-1, Die C |
| Volume Resistivity | – | 1.1×10¹⁵ | Ω·cm | IEC 60093 |
| Dielectric Breakdown Strength | – | 16.2 | kV/mm | IEC 60243-1 |
| Dielectric Constant / Dissipation Factor | – | 2.92 / 0.01 | 1 kHz | IEC 60250 |
| Gas Permeability (O₂/H₂/CO₂) | – | 5.81×10⁻⁶ / 6.03×10⁻⁶ / 3.95×10⁻⁵ | cm²/sec/atm | ASTM D1434 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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