Item Name: ARALDITE® AY 103 / HARDENER HY 991
Manufacturer: Huntsman
Technologies: Epoxy & Epoxy Derivatives
Color: Amber liquid
Cure Type: Ambient and Heat (24 hrs at 20°C, 2 min at 60°C, 15 min at 100°C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 3 years
ARALDITE® AY 103 combined with HARDENER HY 991 is a transparent, low-viscosity epoxy adhesive designed for ease of application. The solvent-free system provides reliable bonding for metals, ceramics, and wood. It can be applied manually or mechanically and cures over a wide temperature range from 68°F (20°C) to 212°F (100°C), delivering good mechanical performance with minimal handling effort.
Compatible Substrates & Surfaces: Ceramic, Metal, Wood
Application Methods: Brush, Spatula, or mechanical metering/mixing equipment
Ideal for structural bonding where low-viscosity adhesives are required.
Curing temperature flexibility allows use in room temperature or elevated temperature processes.
Before Mixing
| Property | Condition / Test Method | Value | Unit |
|---|---|---|---|
| Appearance | — | Amber liquid | — |
| Viscosity | — | Low | — |
After Mixing / Cured
| Property | Cure Temperature | Value | Unit |
|---|---|---|---|
| Lap Shear Strength | 77°F (25°C) | 2,300 | psi (15.9 MPa) |
| Lap Shear Strength | 140°F (60°C) | 1,500 | psi (10.3 MPa) |
| Lap Shear Strength | 176°F (80°C) | 700 | psi (4.8 MPa) |
Curing Recommendations:
68°F (20°C) → 24 hrs
140°F (60°C) → 2 min
212°F (100°C) → 15 min
Storage: Store sealed, dry, +2°C to +40°C; shelf life 3 years. Avoid direct sunlight.
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.