• Item Name: ARALDITE® AW 4804 / HARDENER HW 4804
• Manufacturer: Huntsman
• Technologies: Epoxy & Epoxy Derivatives
• Color: Grey paste
• Cure Type: Elevated temperature cure (≥100°C)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
ARALDITE® AW 4804 / HARDENER HW 4804 is a high-performance, aluminium-filled, two-component epoxy adhesive formulated for exceptional temperature resistance, reaching up to 210 °C after post-cure. It provides long pot life, long open time, and self-levelling flow, making it suitable for precise, automated, or manual application. The system delivers excellent environmental and chemical resistance, maintaining durable performance under heat, ageing, and aggressive media exposure. Its strong adhesion to metals and suitability for elevated-temperature curing make it ideal for demanding structural bonding tasks.
Structural bonding of pretreated aluminium and metals
Industrial assemblies requiring high thermal resistance
Automated or manual adhesive dispensing
Applications exposed to chemicals, heat ageing, or environmental stress
Bonded joints requiring long open time and self-levelling properties
Before Mixing / Unmixed Components
| Property | Value | Notes |
|---|---|---|
| Appearance | Grey paste | Aluminium-filled |
| Mix ratio (by weight) | 100 : 15 | Resin : Hardener |
| Mix ratio (by volume) | 100 : 28 | Resin : Hardener |
| Specific gravity | ~1.65 | — |
| Viscosity | ~17 Pa·s | Self-levelling |
| Property | Value | Test Method / Notes |
|---|---|---|
| Tensile strength | 53 MPa | ISO 527, 24h RT + 2h/90°C |
| Tensile modulus | 6200 MPa | ISO 527 |
| Elongation at break | 1.4% | ISO 527 |
| Shore D hardness | 90 | ISO 868, post-cure |
| CTE | 50 ×10⁻⁶ K⁻¹ | ISO 11359 |
| Tg (various cures) | 60–170°C | Depending on cure schedule |
| Heat resistance | Up to 210°C | After post-cure |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.