• Item Name: LOCTITE® SI 5293
• Manufacturer: Henkel
• Technologies: Silicone, Alkoxy silicone
• Color: Transparent amber to yellow liquid
• Cure Type: UV light with secondary moisture cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE® SI 5293 is a one-component alkoxy silicone designed as a conformal coating for printed circuit boards and sensitive electronic components. It cures initially under ultraviolet (UV) light, with a secondary moisture cure for shadowed areas. The product is transparent amber to yellow and exhibits fluorescence under UV light, providing environmental protection and insulation.
Conformal coating for electronic components
Environmental protection of printed circuit boards
| Property | Uncured | After Mixing / Cured |
|---|---|---|
| Specific Gravity @ 25°C | 1.0 | – |
| Viscosity, Brookfield RVT, 25°C, mPa·s (cP) | 400–800 | – |
| Solids / Non-Volatile Content, % | ≥85 | – |
| Cure Type | UV light; secondary moisture | Fully cured after 7 days @ 22°C / 50% RH |
| Tack Free Time | – | 10–24 hours |
| UV Depth of Cure, mm | – | ≥1.3 |
| Shore Hardness, Durometer OO | – | 60–90 |
| Elongation at break, ISO 37, % | – | 15 |
| Tensile Strength, ISO 37 N/mm² (psi) | – | 0.4 (60) |
| Coefficient of Thermal Expansion, K⁻¹ | – | 300×10⁻⁶ |
| Coefficient of Thermal Conductivity, W/(m·K) | – | 0.18 |
| Glass Transition Temperature, °C | – | -40 |
| Water Vapor Transmission Rate, ASTM E96, g/(h·m²) | – | 1.23–1.37 |
| Volume Resistivity, Ω·cm | – | 1×10¹⁴ |
| Dielectric Breakdown Strength, kV/mm | – | 16 |
| Dielectric Constant / Dissipation Factor | – | 100 Hz: 4.6 / 0.005; 1 kHz: 4.1 / 0.006; 1 MHz: 4.5 / 0.014 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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