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TECHNOMELT® PS 8668 – Pressure-Sensitive Hot Melt Adhesive – Assembly Applications Requiring High Peel, Shear, and Heat Resistance

  • Item Name: TECHNOMELT® PS 8668 (Known as EUROMELT® 80-8668)
  • Manufacturer: Henkel
  • Product Category: Hot Melt Adhesive
  • Technologies: Pressure-Sensitive Hot Melt
  • Applications: Assembly applications requiring high peel, shear, and heat resistance
  • Color: Amber
  • Cure Type: Hot melt (solidifies upon cooling)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

TECHNOMELT® PS 8668 is a high-viscosity, permanent pressure-sensitive hot melt adhesive designed for assembly applications requiring high peel, shear, and heat resistance. It adheres well to various substrates, offering high tack and good green strength. It complies with 21 CFR 175.105 regulations for incidental food contact.

2. Applications

  • Assembly applications needing high peel, shear, and heat resistance
  • Pressure-sensitive adhesive applications
  • Suitable for various substrates

3. Typical Properties

Property Value
Color Amber
Viscosity @ 375°F (Brookfield RVT, cps) 18,000
Viscosity @ 350°F (Brookfield RVT, cps) 36,000
Ring & Ball Softening Point (°F) 284
Application Temperature (°F) 350-375

4. Handling & Safety

  • Avoid contamination by keeping the container covered.
  • No health hazards in solid form, but can cause burns when melted.
  • In case of skin contact with hot adhesive, flush with cold water and seek medical attention.

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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