LOCTITE HHD 4042 is a dual-cure epoxy/acrylate adhesive designed for electronic component assembly. It initially cures with UV light and achieves maximum performance with a secondary heat cure.
| Property | Value |
|---|---|
| Uncured Properties | |
| Appearance | Light yellow paste |
| Viscosity @ 25°C (Spindle 52, 0.5 rpm) | 125,000 mPa·s (cP) |
| Specific Gravity @ 25°C | 1.63 |
| Pot Life @ 25°C (away from light) | 8 days |
| Curing Performance | |
| UV Wavelength Range | 300-500 nm |
| UV Tack-Free Time | <6 seconds |
| Heat Cure Schedule | 1 hour @ 120°C |
| Cured Properties | |
| Glass Transition Temperature (Tg) | 145°C |
| Coefficient of Thermal Expansion (α1) | 45.38×10⁻⁶ cm/cm/°C |
| Coefficient of Thermal Expansion (α2) | 138.73×10⁻⁶ cm/cm/°C |
| Volume Shrinkage on Cure | 3.1% |
| Mechanical Performance | |
| Lap Shear Strength (Steel) | 21 N/mm² (3,045 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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