LOCTITE ABLESTIK 8200T is an electrically conductive die attach adhesive designed for high-reliability package applications. It features:
| Property | Value |
|---|---|
| Thixotropic Index (0.5/5 rpm) | 4.8 |
| Viscosity (Brookfield CP51, 5 rpm, 25°C) | 9,000 mPa·s (cP) |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
| Property | Value |
|---|---|
| Physical Properties | |
| Coefficient of Thermal Expansion (CTE) | Below Tg: 61 ppm/°C, Above Tg: 195 ppm/°C |
| Glass Transition Temperature (Tg) | 241°C |
| Thermal Conductivity | 2.5 W/m-K |
| Moisture Absorption (@ 85°C/85% RH) | 0.3% |
| Mechanical Properties (Tensile Modulus, DMTA) | |
| @ -65°C | 9,356 N/mm² (1,356,973 psi) |
| @ 25°C | 7,840 N/mm² (1,137,096 psi) |
| @ 100°C | 6,337 N/mm² (919,104 psi) |
| @ 150°C | 5,092 N/mm² (738,532 psi) |
| @ 200°C | 3,356 N/mm² (486,746 psi) |
| @ 250°C | 2,921 N/mm² (423,655 psi) |
| @ 300°C | 4,345 N/mm² (630,189 psi) |
| Electrical Properties | |
| Volume Resistivity | 0.0001 ohm·cm |
| Test | Result |
|---|---|
| Die Shear Strength (3×3 mm Si die on Ag/Cu leadframe) | @ 25°C: 10 kg-f, @ 200°C: 7 kg-f, @ 250°C: 5.5 kg-f |
| Weight Loss on Cure | 7.0% |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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