| Property | Value |
|---|---|
| Uncured Properties | |
| Viscosity (5 rpm @ 25°C) | 18,500 cP |
| Thixotropic Index | 4.8 |
| Specific Gravity | 4.1 |
| Pot Life (@ 25°C) | 24 hours |
| Shelf Life (@ -40°C) | 365 days |
| Curing Performance | |
| Snap Cure (Single Zone) | 60 sec @ 185°C |
| Alternate Snap Cure | 170-200°C for 70 sec (7-zone profile) |
| Oven Cure | 30 min @ 185°C / 30 min @ 200-220°C (for higher adhesion) |
| Cured Properties | |
| Coefficient of Thermal Expansion (CTE) | 53 ppm/°C (below Tg), 156 ppm/°C (above Tg) |
| Glass Transition Temperature (Tg) | 3.3°C |
| Thermal Conductivity | 6.5 W/(m·K) |
| Tensile Modulus (@ 25°C) | 3,300 N/mm² (478,500 psi) |
| Extractable Ionic Content (ppm) | Cl-, K+, Na+, F- ≤ 20 ppm |
| Electrical Properties | |
| Volume Resistivity | 4 × 10⁻⁵ ohm-cm |
| Performance | |
| Die Shear Strength (300×300 mil die on Ag/Cu LF) | 57 kg-f (@ 25°C), 21 kg-f (@ 245°C) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
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