| Property | Value |
|---|---|
| Gel Time @ 121°C | 12 minutes |
| Shelf Life @ -40°C | 274 days |
| Viscosity @ 25°C | 32,000 cps |
| Specific Gravity | 1.79 |
| Particle Size (max) | 25 µm |
| Pot Life @ 25°C | 4 days |
| Cure Condition | Duration |
|---|---|
| 125°C | 30 minutes |
| 165°C | 90 minutes |
| Alternative Cure: | |
| 110°C | 1 hour |
| 165°C | 3 hours |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 164°C |
| Coefficient of Thermal Expansion (ppm/°C) | Below Tg: 21, Above Tg: 72 |
| Thermal Conductivity @ 100°C | 0.62 W/(m-K) |
| Alpha Particle Emissions | 0.001 cts/cm²/hr |
| Extractable Ionic Content | Cl⁻: 2 ppm, Na⁺: 1 ppm, K⁺: 1 ppm |
| Frequency | Dielectric Constant | Dissipation Factor |
|---|---|---|
| 5 GHz | 3.56 | 0.0029 |
| 10 GHz | 3.55 | 0.0062 |
| 20 GHz | 3.52 | 0.0069 |
| 30 GHz | 3.51 | 0.0058 |
| 40 GHz | 3.52 | 0.0058 |
| 50 GHz | 3.49 | 0.017 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
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