Applications

LOCTITE® 3609 – Epoxy surface mount adhesive for bonding SMDs to PCBs before wave soldering

  • Item Name: LOCTITE 3609
  • Manufacturer: Henkel
  • Product Category: Surface mount adhesive
  • Technologies: One-component epoxy system (no mixing required)
  • Applications: Bonding SMD components to PCBs prior to wave soldering; suitable for small parts bonding
  • Color: Dark red viscous gel
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

LOCTITE 3609 is a red, one-component, epoxy adhesive designed for surface mount device (SMD) bonding. It offers high adhesion strength, excellent electrical properties, and superior resistance to humidity and environmental stress. The adhesive is optimized for dispensing applications and provides outstanding thermal and mechanical reliability.

2. Applications

  • Used for bonding surface mount devices (SMDs) in PCB assembly.
  • Suitable for reflow soldering processes.
  • Ideal for high-speed dispensing applications in electronics manufacturing.
  • Provides strong adhesion to various substrates, including FR4, metals, and ceramic materials.

3. Typical Properties

Property Before Curing (Unmixed) After Curing (Mixed)
Appearance Red, viscous liquid Solid, durable adhesive
Chemical Type Epoxy resin Thermoset polymer
Viscosity @ 25°C (mPa·s) ~20,000 – 35,000 N/A
Density (g/cm³) ~1.15 ~1.2
Cure Time @ 150°C ~90 seconds Fully cured
Glass Transition Temp (°C) N/A ~125°C
Thermal Conductivity (W/mK) N/A ~0.25
Dielectric Strength (kV/mm) N/A ~15
Volume Resistivity (Ω·cm) N/A ~1.0 × 10¹³
Hardness (Shore D) N/A ~85

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