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BERGQUIST LIQUI FORM TLF LF3500 – Liquid Thermal Gap Filler – High-Performance Electronics and Power Modules

  • Item Name: BERGQUIST LIQUI FORM TLF LF3500
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Gel (Thermal Interface Material – TIM)
  • Technologies: Silicone-based, Pre-cured Gel, Thixotropic Properties
  • Applications:
    • Handheld devices
    • Bare die to heat spreader lid
    • Gap filling between heat-generating devices and heat sinks
    • Low assembly pressure applications
    • High-value assemblies requiring rework
    • BGA, PGA, PPGA
  • Color: Gray
  • Cure Type: Pre-cured (No curing required)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 3.5 months (104 days) at 25°C

1. Product Overview

BERGQUIST LIQUI FORM TLF LF3500 is a thermally conductive, one-part liquid formable gel designed for thermal management applications. It is a pre-cured, dispensable gel that offers excellent thermal conductivity and stability.

  • Technology: Silicone
  • Appearance: Gray
  • Cure Type: Pre-cured gel (no curing required)
  • Operating Temperature Range: -60 to 200°C
  • Thermal Conductivity: 3.5 W/m-K
  • Flammability Rating: UL 94 V-0
  • Key Features:
    • No mixing or refrigeration required
    • Stable viscosity
    • Excellent chemical and mechanical stability
    • Low applied stress and long-term reliability

2. Applications

  • Handheld devices
  • Bare die to heat spreader lid
  • Heat-generating components to heat sinks
  • Low-assembly pressure applications
  • High-value assemblies with reworkability
  • BGA, PGA, and PPGA components

3. Typical Properties

Property Value Test Standard
Uncured Material
Density 3.1 g/cc ASTM D792
Shelf Life (at 25°C) 104 days
Cured Material
Dispense Rate 40 g/min
Volumetric Expansion (25–275°C) 200 ppm ASTM E228
Electrical Properties
Dielectric Strength 10,000 V/mm ASTM D149
Dielectric Constant (1,000 Hz) 8.1 ASTM D150
Volume Resistivity 1 × 10¹¹ Ω·m ASTM D257
Outgassing Properties
Total Mass Loss 0.14% ASTM E595
Thermal Properties
Thermal Conductivity 3.5 W/(m-K) ASTM D5470
Thermal Impedance (ASTM D5470)
@ 10 psi 0.07 °C-in²/W
@ 25 psi 0.07 °C-in²/W
@ 50 psi 0.06 °C-in²/W

4. Storage & Handling

  • Storage Temperature: 5 to 25°C
  • Shelf Life: 104 days in sealed containers with moisture barrier
  • Thawing Instructions:
    1. If refrigerated, allow to reach room temperature before use.
    2. Do not open until contents reach 25°C to prevent moisture contamination.

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