BERGQUIST GAP FILLER TGF 1450 is a two-part, high-performance, thermally conductive liquid gap filler designed for thermal management applications. It features a shear-thinning viscosity for easy dispensing and offers low stress on sensitive components. The material cures at room temperature or can be accelerated with heat curing.
Key Features & Benefits:
| Property | Test Method | Value |
|---|---|---|
| Viscosity (High Shear, 3,000 s⁻¹) | ASTM D5099 | 30 Pa∙s |
| Viscosity (Low Shear, 1 s⁻¹) | ASTM D2196 | 200 Pa∙s |
| Density | ASTM D792 | 1.85 g/cc |
| Pot Life @ 25°C | ASTM D4473 | 60 minutes |
| Temperature | Time |
|---|---|
| 25°C | 5 hours |
| 100°C | 10 minutes |
| Alternate 100°C Cure | 30 minutes |
| Property | Test Method | Value |
|---|---|---|
| Hardness (Shore 00, 30s delay) | ASTM D2240 | 40 |
| Heat Capacity | ASTM D1269 | 1.0 J/g-K |
| Property | Test Method | Value |
|---|---|---|
| Dielectric Strength | ASTM D149 | 275 V/mil |
| Dielectric Constant @ 1,000Hz | ASTM D150 | 6.4 |
| Volume Resistivity | ASTM D257 | 1×10¹⁰ ohm-meter |
| Property | Test Method | Value |
|---|---|---|
| Thermal Conductivity | ASTM D5470 | 1.5 W/m-K |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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