BERGQUIST GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone-based liquid gap filler with extremely low viscosity. It provides excellent thermal transfer, self-leveling properties, and a soft, vibration-dampening cured form. This material is designed for use in applications requiring thermal interface materials (TIM) with minimal stress to components.
Key Features:
| Property | Value | Test Standard |
|---|---|---|
| Mixed Viscosity | 5,000 mPa·s (cP) | ASTM D2196 |
| Density | 2.5 g/cc | ASTM D792 |
| Working Time (@25°C) | 120 minutes | – |
| Shelf Life (@25°C) | 180 days | – |
| Cure Condition | Time |
|---|---|
| Room Temperature Cure | 24 hours @ 25°C |
| Heat Cure | 30 minutes @ 100°C |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore 00) | 40 | ASTM D2240 |
| Heat Capacity | 0.9 J/g-K | ASTM E1269 |
| Flammability Rating | V-0 | UL 94 |
| Siloxane Content (ΣD4-D10) | 40 ppm | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength | 250 V/mil | ASTM D149 |
| Dielectric Constant (@1,000 Hz) | 6.0 | ASTM D150 |
| Volume Resistivity | 1×10¹¹ ohm-meter | ASTM D257 |
| Property | Value | Test Standard |
|---|---|---|
| Thermal Conductivity | 1.4 W/(m-K) | ASTM D5470 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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