1. Product Overview
LOCTITE STYCAST EE 4186 HD 3561 is a two-component epoxy system designed for encapsulation and potting applications. It features a low coefficient of thermal expansion (CTE), low shrinkage, and high impact strength, preventing microscopic cracking when flexible wire leads protrude from the encapsulation. The system adheres well to lead materials like vinyl and neoprene.
2. Applications
3. Typical Properties
| Property | Part A (Resin) | Part B (Hardener) | Mixed | Cured |
|---|---|---|---|---|
| Appearance | Tan | Tan | Tan | Tan |
| Density (g/cc, 25°C) | 1.8 | 1.01 | 2.1 | – |
| Viscosity (mPa·s, 25°C) | 150,000 | 20 | 4,000 | – |
| Filler Content (%) | 65 | – | 59 | – |
| Pot Life (200g mass, 25°C) | – | – | 80 min | – |
| Peak Exotherm Temperature (200g mass, °C) | – | – | 115°C | – |
| Cure Schedule (Recommended) | – | – | 3 hrs @ 60°C or 24 hrs @ 25°C | – |
4. Typical Properties of Cured Material
| Physical Properties | Value |
|---|---|
| Coefficient of Linear Thermal Expansion (30-70°C) | 50 x 10⁻⁶ in/in/°C |
| Coefficient of Linear Thermal Expansion (70-90°C) | 110 x 10⁻⁶ in/in/°C |
| Elongation (%) | 1.9 |
| Hardness (Shore D) | 95 |
| Heat Deflection Temperature (°C) | 85 |
| Izod Impact Strength (ft-lb/in) | 0.24 |
| Linear Shrinkage (%) | 0.31 |
| Moisture Absorption (24 hrs, %) | 0.113 |
| Thermal Conductivity (cal·cm/sec·cm²·°C) | 18 x 10⁻⁴ |
5. Electrical Properties
| Property | Value |
|---|---|
| Dielectric Strength (V/mil, 10 mil) | 1,400 |
| Dielectric Strength (V/mil, 20 mil) | 1,585 |
| Arc Resistance (sec) | 190 |
| Volume Resistivity (Ω·cm, 25°C) | 2 × 10¹⁶ |
| Volume Resistivity (Ω·cm, 80°C) | 4.6 × 10¹² |
Dielectric Constant / Dissipation Factor:
| Frequency | @ 25°C | @ 80°C |
|---|---|---|
| 100 Hz | 4.8 / 0.11 | 6.3 / 0.078 |
| 1 kHz | 4.8 / 0.008 | 5.8 / 0.052 |
| 10 kHz | 4.52 / 0.013 | 5.45 / 0.036 |
| 100 kHz | 4.6 / 0.022 | 5.21 / 0.025 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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