TECHNOMELT® PA 6344 is a one-component polyamide hot melt adhesive designed for low-pressure molding applications. It offers low viscosity, enabling the encapsulation of fragile components without damage. The product forms a protective barrier against environmental factors, providing heat stability, moisture resistance, and UV stability. It is suitable for exterior applications and meets UL 94 V2 flammability standards.
| Property | Value | Test Method |
|---|---|---|
| Appearance | Black | – |
| Specific Gravity (g/cm³) | 1.00 | ASTM D792 |
| Softening Point (°C) | 142 | ASTM E28 (in glycerin) |
| Molding Temperature (°C) | 190 – 230 | – |
| Operating Temperature Range (°C) | 0 – 100 | – |
| Melt Viscosity (mPa·s) | ASTM D3236 | |
| @ 200°C | 18,000 | |
| @ 210°C | 11,000 | |
| @ 225°C | 7,000 | |
| @ 240°C | 3,800 | |
| Shore Hardness (Durometer A) | 80 | ASTM D2240 |
| Elongation (%) | 700 | ASTM D638 |
| E-modulus (N/mm²) | 27.6 (4000 psi) | ASTM D638 |
| Temperature Creep Resistance (°C) | 120 | Henkel Method MH 11 |
| Glass Transition Temperature (°C) | 0 | DSC Second Run |
| Water Absorption (%), 1 day | 0.5 | – |
| Water Absorption (%), 7 days | 1.4 | – |
| Property | Value | Test Method |
|---|---|---|
| Dielectric Constant / Dissipation Factor | Open-ended coaxial probe | |
| @ 1 MHz | 3.18 / 0.0729 | |
| @ 1 GHz | 2.84 / 0.0214 | |
| @ 1.8 GHz | 2.81 / 0.0188 | |
| @ 5.0 GHz | 2.78 / 0.0138 | |
| @ 10 GHz | 2.77 / 0.0099 | |
| @ 20 GHz | 2.76 / 0.0078 | |
| Dielectric Strength (kV/mm) | 23 | ASTM D149 |
| Volume Resistivity (ohm·cm) | 4.8 x 10¹² | ASTM D257 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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