-Item Name: LOCTITE® ECCOBOND UF 3808
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 12 months
Product Name: LOCTITE® ECCOBOND UF 3808
Technology: Epoxy
Appearance: Black liquid
Components: One-component
Cure Type: Heat cure
Key Benefits:
Application: Underfill
Typical Assembly Applications: Chip scale packages (CSP) and ball grid arrays (BGA)
LOCTITE® ECCOBOND UF 3808 is a capillary underfill designed to:
| Property | Value |
|---|---|
| Viscosity (mPa·s) @ 1,000 s⁻¹ | 348 |
| Specific Gravity | 1.16 |
| Pot Life @ 25°C (25% viscosity increase) | 3 days |
| Shelf Life @ -20°C | 365 days |
| Cure Schedule | Time & Temperature |
|---|---|
| Standard Cure | ≥8 minutes @ 130°C |
| Alternative Cure | 5 minutes @ 150°C |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (ppm/°C) Below Tg | 55 |
| Coefficient of Thermal Expansion (ppm/°C) Above Tg | 171 |
| Glass Transition Temperature (Tg) (°C) | 113 |
| Storage Modulus @ 25°C (N/mm² / psi) | 2,610 / 379,000 |
| Property | Value |
|---|---|
| Dielectric Constant @ 23°C, 1 GHz | 3.19 |
| Dissipation Factor @ 23°C, 1 GHz | 0.0099 |
| Dielectric Constant @ 23°C, 2 GHz | 3.24 |
| Dissipation Factor @ 23°C, 2 GHz | 0.0088 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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