-Item Name: LOCTITE® ECCOBOND UF 9000AG-061
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 12 months
LOCTITE® ECCOBOND UF 9000AG-061 is a black, one-component epoxy underfill encapsulant designed for FCBGA and Cu pillar applications. It provides fast flow, low coefficient of thermal expansion (CTE), and long work life, making it ideal for advanced semiconductor packaging. The material forms a rigid, self-filleting protective seal, enhancing solder joint reliability by dissipating stress and ensuring excellent electrical, thermal, and moisture resistance.
| Properties | Uncured State (Before Mixing) |
|---|---|
| Appearance | Black liquid |
| Specific Gravity (g/cm³) | 1.74 |
| Viscosity (Brookfield, 25°C, CP51 @ 5 rpm) | 11,930 mPa·s (cP) |
| Work Life (25°C) | 24 hours |
| Shelf Life (-40°C) | 365 days |
| Properties | Cured State (After Mixing) |
|---|---|
| Cure Schedule | 15 min ramp to 100°C, 90 min hold @ 100°C + 15 min ramp to 165°C, 2 hr hold @ 165°C |
| Alternate Cure Schedule | 30 min ramp to 90°C, 4 hr hold @ 90°C + 30 min ramp to 150°C, 2 hr hold @ 150°C |
| Coefficient of Thermal Expansion (CTE) – Below Tg | 19 ppm/°C |
| Coefficient of Thermal Expansion (CTE) – Above Tg | 62 ppm/°C |
| Glass Transition Temperature (Tg) by TMA | 135°C |
| Glass Transition Temperature (Tg) by DMA | 160°C |
| Storage Modulus (DMA @ 25°C) | 15 GPa (15,000 N/mm², 2.18×10⁶ psi) |
| Storage Modulus (DMA @ 250°C) | 0.4 GPa (400 N/mm², 58,000 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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