LOCTITE® ECCOBOND LUX AA50T is an acrylate-based, high-viscosity, fast-curing adhesive designed for die attach applications in optoelectronic devices, LED mounting, laser diode packaging, fiber pigtailing, and transceiver active alignment and potting. This product offers fast UV cure, low shrinkage, and excellent mechanical stability. It cures quickly under UV (365 nm) or visible (470 nm) light and has a secondary thermal cure option for shadowed areas.
LOCTITE® ECCOBOND LUX AA50T is ideal for:
| Property | Value |
|---|---|
| Technology | Acrylate |
| Appearance | Opaque white |
| Viscosity (Brookfield, 25°C, 5 rpm) | 96,000 mPa·s (cP) |
| Shelf Life (0-5°C) | 180 days |
| Pot Life (Room Temp) | 90 days |
| Cure Method | Condition |
|---|---|
| UV or Visible Light | Fast cure under exposure |
| Secondary Thermal Cure | 60 minutes @ 100°C |
| Property | Value |
|---|---|
| Hardness (Shore D) | 82 |
| Glass Transition Temperature (Tg) | 163°C |
| Coefficient of Thermal Expansion (Below Tg) | 36 ppm/°C |
| Coefficient of Thermal Expansion (Above Tg) | 98 ppm/°C |
| Water Absorption (24 hrs) | 0.86% |
| Tensile Modulus (DMTA, @ 25°C) | 3,500 N/mm² (509,000 psi) |
| Die Shear Strength (2×2 mm Si die on Ag/Cu LF) | 3,990 psi |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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