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Thermal Management

HumiSeal® 1B15 – Acrylic Conformal Coating for PCB Protection

– Item Name: HumiSeal® 1B15
– Manufacturer: HumiSeal
– Technologies: Single-component acrylic conformal coating
– Color: Not specified
– Certifications: RoHS Directive 2002/95/EC
– Cure Type: 24 hrs at room temperature or 30 min at 76°C
– Package Size: Contact Techniq VN for details.
– Shelf Life: 18 months

1. Product Overview

HumiSeal® 1B15 is a single-component, fast-drying acrylic conformal coating designed for printed circuit assemblies. It is easily repairable and RoHS Directive 2002/95/EC compliant.

2. Applications

  • Protection of printed circuit boards (PCBs)
  • Applied via dipping, spraying, or brushing
  • Suitable for applications requiring moisture and electrical insulation

3. Typical Properties

Property Value Test Method
Density 0.91 ± 0.02 g/cm³ ASTM D1475
Solids Content 35 ± 3% Fed-Std-141, Meth. 4044
Viscosity 470 ± 20 centipoise Fed-Std-141, Meth. 4287
VOC Content 590 g/L
Drying Time to Handle 10 minutes Fed-Std-141, Meth. 4061
Recommended Coating Thickness 25 – 75 microns
Curing Time 24 hrs @ RT or 30 min @ 76°C
Time to Reach Optimum Properties 7 days
Thermal Shock Resistance -65°C to 125°C MIL-I-46058C
Coefficient of Thermal Expansion 77 ppm/°C
Glass Transition Temperature (Tg) 15°C DSC
Modulus 69.5 MPa DMA
Dielectric Withstand Voltage >1500 volts MIL-I-46058C
Dielectric Constant (1MHz, 25°C) 2.03 ASTM D150-98
Dissipation Factor (1MHz, 25°C) 0.01 ASTM D150-98
Insulation Resistance 3.5 × 10¹⁴ ohms (350TΩ) MIL-I-46058C
Moisture Insulation Resistance 4.0 × 10¹⁰ ohms (40GΩ) MIL-I-46058C
Fungus Resistance Passes ASTM G21

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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