Indium 800520-600G is a no-clean, leaded solder paste formulated for high-reliability SMT assembly. Composed of Sn63Pb37 alloy with Type 3 powder, it provides high transfer efficiency, oxidation resistance, and reliable wetting. The halogen-free flux ensures clean residue and excellent electrical reliability, making it ideal for mixed SnPb and Pb-free processes.
| Property | Specification |
|---|---|
| Brand | Indium |
| Alloy | Sn63Pb37 (63% Tin, 37% Lead) |
| Flux Type | No-Clean (ROL0) |
| Lead Content | Leaded |
| Powder Mesh Size | T3 |
| Metal Percentage | 90% |
| Halogen Content | Halogen-Free |
| Package Type | 600g Cartridge |
| Shelf Life | 1 Year |
| Physical State | Paste |
| Series | 8.9HF Series |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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