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AIM W20 Water Soluble Solder Paste – A zero halide/halogen

  • Item Number: W20
  • Manufacturer: AIM
  • Lead Type: Available in Lead-Free and Leaded Versions
  • Alloys: Contact Avantek for details.
  • Type: Water Soluble, Zero Halide/Halogen
  • Powder Sizes: T4, T5
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

AIM’s W20 is a zero halide/halogen water-soluble solder paste formulated for enhanced wetting on all solderable electronic surfaces. It offers excellent print characteristics, extended stencil life (8+ hours), and easy residue removal using plain water. The formulation ensures compliance with RoHS and J-STD-004/B standards.

2. Applications

  • Suitable for PCB assembly and electronics manufacturing
  • Designed for fine-pitch printing with availability in T4 and T5 powder sizes
  • Effective for low stand-off components, ensuring complete residue removal
  • Extended cleaning window of 2+ weeks, making it ideal for long-term processing

3. Typical Properties – Specifications

Property Test Method Typical Result
Flux Classification J-STD-004B ORM0
Halogen Content EN 14582 400 ppm (Halogen-Free)
Quantitative Halides IPC-TM-650 2.3.28.1 200 ppm (Halide-Free)
Copper Mirror Test J-STD-004B 3.4.1.1 Medium (<50% Breakthrough)
Corrosion Test J-STD-004B 3.4.1.2 Pass
Surface Insulation Resistance IPC-TM-650 2.6.3.7 >100 MΩ
Acid Value IPC-TM-650 2.3.13 54.2 mgKOH/g flux
Viscosity (Brookfield) IPC-TM-650 2.4.34 500 – 800 kcps
Viscosity (Malcolm) IPC-TM-650 2.4.34 150 – 210 Pa.s
Tack Strength IPC-TM-650 2.4.44 43.8 gf
Slump Test J-STD-005A 3.6 Pass
Solder Ball Test J-STD-005A 3.7 Pass (15 min & 4 hours)
Wetting Test J-STD-005A 3.9 Pass

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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