NC259FPA is an ultrafine no-clean solder paste developed by AIM for use with Type 6 and finer solder powder. It provides high transfer efficiency, precise print definition, and excellent wetting with shear values up to 150 gf. The flux residue is water-clear and has high surface insulation resistance (SIR). This solder paste offers a long stencil life of up to 8 hours and is recommended for nitrogen reflow. It is also zero-halogen and meets industry standards.
| Property | Test Method | Results |
|---|---|---|
| IPC Flux Classification | J-STD-004A, B, C 3.3 | ROL0 |
| Copper Mirror | IPC-TM-650 2.3.32 | No breakthrough |
| Corrosion | IPC-TM-650 2.6.15 | No corrosion |
| Quantitative Halides | IPC-TM-650 2.3.28.1 | <0.05% (Low) |
| Qualitative Halides | IPC-TM-650 2.3.33 (Silver Chromate) | PASS |
| Halogen Content | EN 14582 | Halogen-free |
| Surface Insulation Resistance (SIR) | IPC-TM-650 2.6.3.7 | ≥ 100 MΩ (No-clean state) |
| Flux Solids Content | IPC-TM-650 2.3.34 | 74% solids |
| Acid Value | IPC-TM-650 2.3.13 | 174.2 mg KOH/g |
| Viscosity (Malcom) | IPC-TM-650 2.4.34 | 170-210 PaS* |
| Slump Resistance | IPC-TM-650 2.4.35 | PASS |
| Tack Force | JIS standard Z 3284 | 120 gf |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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