Item Name: Shin-Etsu X23-7762
Manufacturer: Shin-Etsu MicroSi (SEM), USA
Technologies: Thermal interface material (TIM)
Color: Grey
Viscosity: 140 Pa·s (pre-flash), 700 Pa·s (post-flash)
Thermal Conductivity: 6.5 W/m·K (post-flash)
Thermal Resistance: 12.8 mm²·K/W
BLT (Bond Line Thickness): 72 µm (20 psi)
Package Sizes: Syringes (0.5 g, 1 g), Cartridges (55 g), Bulk (1 kg can), custom sizes available
Storage Conditions: 60–85 °F
Shelf Life: Contact Techniq VN for details
Shin-Etsu X23-7762 is a thermal interface material (TIM) designed for high-performance semiconductor devices. It combines high thermal conductivity (6.5 W/m·K post-flash) with low thermal resistance (12.8 mm²·K/W), ensuring excellent heat dissipation for improved device reliability. The product is low-viscosity during application, enabling easy dispensing, stencil printing, or screen printing, and becomes more viscous after solvent evaporation (“application chemical” flash-off). It is RoHS and REACH compliant and widely available in multiple package forms for production and field use.
Thermal management of high-performance semiconductor devices
Use in high-volume production environments requiring consistent thermal performance
Dispensing, stencil, or screen-printing application methods
| Property | Value / Description |
|---|---|
| Color | Grey |
| Viscosity (Pa·s, pre-flash) | 140 |
| Viscosity (Pa·s, post-flash) | 700 |
| Thermal Resistance (mm²·K/W) | 12.8 |
| Thermal Conductivity (W/m·K, post-flash) | 6.5 |
| BLT (Bond Line Thickness, µm @ 20 psi) | 72 |
| Packaging Options | Syringes (0.5 g, 1 g), Cartridges (55 g), Bulk (1 kg can), Custom sizes |
| Storage Conditions | 60 °F – 85 °F |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.