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Alpha RF-800 liquid flux – versatile no-clean rosin-based flux formulated for wave and selective soldering, ensuring reliable wetting, reduced bridging, and excellent surface insulation resistance for diverse PCB assemblies.

  • Item Number: RF-800

  • Manufacturer: MacDermid Alpha®

  • Flux Type/ Chemistry: No-clean, rosin-based liquid flux

  • Viscosity/ Form: Low viscosity liquid

  • Activity/ Classification: IPC J-STD-004 classification ROL0

  • Packaging: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for detail

1. Product Overview

Alpha RF-800 Liquid Flux is a high-performance, no-clean flux formulated for both lead-free and tin-lead soldering applications. It ensures superior wetting, consistent solder joint formation, and minimal residues, providing reliable performance in electronics assembly. The flux is designed to support fine-pitch components and high-density PCB assemblies, offering precise and repeatable soldering results.

2. Applications

RF-800 is suitable for wave soldering, selective soldering, hand soldering, and rework operations. It is widely used in PCB assembly, repair, and rework processes where controlled and reliable soldering is critical. The flux performs effectively in both automated and manual soldering methods.

3. Typical Properties – Specifications

  • Flux Type: No-clean, mildly activated

  • Form: Liquid

  • Halogen Content: Halogen-free

  • Residues: Minimal, non-corrosive, compatible with no-clean processes

  • Compatibility: Works with lead-free and tin-lead solder alloys

  • Activation: Provides consistent wetting and reliable solder joints

  • Storage: Store in a cool, sealed container to maintain flux activity and shelf life

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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