Item Number: TSF-6592
Manufacturer: Kester®
Flux Type/ Chemistry: No-clean tacky flux
Viscosity/ Form: High-viscosity tacky flux (paste form)
Activity/ Classification: IPC J-STD-004 classification ROL0
Packaging: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Kester TSF-6592 is a high-performance solder paste flux, formulated to deliver exceptional wetting and reliable solder joint formation. Designed for fine-pitch and high-density surface mount assemblies, it ensures consistent process stability and minimal defects. This flux is halogen-free, environmentally compliant, and engineered to leave minimal, non-corrosive residues, making it suitable for advanced electronics manufacturing.
TSF-6592 is ideal for reflow soldering in surface mount technology (SMT) applications, including QFPs, BGAs, and other fine-pitch components. Its excellent tackiness and rheology make it suitable for stencil printing, selective dispensing, and rework processes, ensuring precision and reproducibility in high-volume production.
Flux Type: Tacky, halogen-free
Viscosity: Optimized for stencil printing and dispensing
Residues: Minimal, non-corrosive, suitable for no-clean processes
Compatibility: Works with a wide range of leaded and lead-free solder alloys
Reflow Performance: Maintains robust activity under both standard and lead-free reflow profiles
Storage: Keep refrigerated to maintain flux performance and consistency
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