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Elan-tron® MC 41 + WH 441 100:100 – Filled, flame-retardant epoxy for semiconductor encapsulation, hot curing up to 180°C

  • Item Name: Elan-tron® MC 41 + WH 441 100:100

  • Manufacturer: ELANTAS Beck India Ltd.

  • Technologies: Two-component filled epoxy system, self-extinguishing, halogen-, phosphorus- and antimony-free, excellent electrical and thermal properties

  • Color: Resin – Black, Hardener – Off-white

  • Cure Type: Elevated temperature cure; recommended 4 h at 80°C + 4 h at 140°C

  • Package Size: 25 kg (both resin and hardener)

  • Shelf Life: Resin 12 months, Hardener 6 months

1. Product Overview

Elan-tron® MC 41 + WH 441 is a two-component, filled, flame-retardant epoxy system designed for high-temperature encapsulation of semiconductors and components. It is halogen-, phosphorus-, and antimony-free, with UL 94 V-0 self-extinguishing behavior, strong mechanical strength, and excellent dielectric insulation. The system supports continuous operation at 150–160 °C, with peak resistance up to 180 °C, making it suitable for demanding environments where thermal endurance and flame resistance are critical.


2. Applications

  • Encapsulation of semiconductors and electronic modules

  • Electrical components exposed to elevated operating temperatures

  • Potting of devices requiring flame retardancy and high glass transition stability

  • Manual or vacuum casting (automatic mixing/dispensing possible)

3. Typical Properties

Supplied Components

Property Resin (MC 41) Hardener (WH 441)
Appearance Black, filled liquid Off-white, filled liquid
Viscosity at 25 °C 50,000–70,000 mPa·s 14,000–20,000 mPa·s
Density at 25 °C 1.69–1.73 g/ml 1.77–1.81 g/ml
Shelf Life 6 months 6 months

Mixed System & Processing

Property Value
Mixing Ratio (by weight) 100:100
Initial Viscosity (25 °C) 43,000–63,000 mPa·s
Initial Viscosity (60 °C) 5,500–8,500 mPa·s
Pot Life at 25 °C >7 h
Pot Life at 80 °C 70–80 min
Recommended Cure 4 h at 80 °C + 4 h at 140 °C
Processing Manual or vacuum casting, hot curing

Cured Properties (Cure: 4 h at 80 °C + 4 h at 140 °C)

Property Value
Density (25 °C) 1.73–1.77 g/ml
Flexural Strength 50–60 MPa
Flexural Modulus 7,500–8,000 MPa
Tensile Strength 27–33 MPa
Elongation at Break 0.5–1.0 %
Strain at Break 0.8–1.3 %
Hardness 89–93 Shore D
Glass Transition (Tg) 160–165 °C
Thermal Conductivity 0.83–0.93 W/m·K
Water Absorption (24 h at RT) 0.01–0.04 %
Water Absorption (2 h at 100 °C) 0.15–0.20 %
Linear Thermal Expansion (below Tg) 20–25 ×10⁻⁶/°C
Linear Thermal Expansion (above Tg) 85–105 ×10⁻⁶/°C
Flammability UL 94 V-0 (6.4 mm)

Dielectric Properties

Property Value
Dielectric Strength (2 mm specimen) 20–22 kV/mm
Volume Resistivity 3–5 ×10¹⁵ Ω·cm
Dielectric Constant (25 °C) 2.8–3.1
Dielectric Constant (140 °C) 3.2–3.5
Dielectric Loss Factor (25 °C) 3–5 ×10⁻³
Dielectric Loss Factor (140 °C) 16–21 ×10⁻³

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