Applications

CoolTherm® SC-6703 Encapsulant – Thermally conductive silicone system for power electronics with low stress and flame resistance

  • Item Name: CoolTherm® SC-6703 Silicone Encapsulant

  • Manufacturer: Parker Lord (Parker Hannifin Corporation)

  • Technologies: Two-component thermally conductive silicone encapsulant

  • Color: Black, White, or Light Gray (depending on resin/hardener combination)

  • Cure Type: Heat cure (4 hours at 65°C or 1–2 hours at 65°C)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 6 months

1. Product Overview

CoolTherm® SC-6703 is a two-component, thermally conductive silicone encapsulant designed for encapsulating densely packed power units. The material provides excellent thermal management while minimizing stress and shrinkage on components during cure. It delivers superior resistance to thermal shock and is UL 94 V-0 rated for flame retardancy, making it suitable for demanding electronic and electrical applications.


2. Applications

  • Encapsulation of densely packed power modules requiring effective heat dissipation.

  • High-volume production with automated meter/mix/dispense equipment.

  • Critical electronic applications where void-free encapsulation and insulation are essential.

  • Situations requiring compliance with UL 94 V-0 flammability standards.

  • Suitable for molding processes with 4-hour cure at 65°C or 1–2 hours at 65°C depending on conditions.

3. Typical Properties

Property SC-6703 Resin SC-6703 Hardener Mixed
Appearance Black or White Liquid White Liquid Light Gray (Black Resin) / White (White Resin)
Viscosity, cP @ 25°C 15,000 6,000 8,000
Specific Gravity 2.09 1.91 2.0
Gel Time, min @ 66°C 12–14
Working Life, hrs @ 25°C 1–2

Cured Properties

  • Thermal Conductivity: 0.8 W/m·K

  • Coefficient of Linear Thermal Expansion: 220 ppm/°C

  • Hardness: Shore A 60

  • Tensile Strength: 1.38 MPa (200 psi)

  • Elongation at Break: 80%

  • Volume Resistivity: 1 × 10¹⁴ ohm-cm

  • Dielectric Strength: 19.7 kV/mm (500 V/mil)

  • Dielectric Constant (1 MHz): 4.25

  • Dissipation Factor (1 MHz): 0.02

The encapsulant balances high thermal conductivity with robust electrical insulation, mechanical resilience, and flame retardancy, ensuring reliability in harsh operational environments

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