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Thermal Management

Momentive TSE3331 – Heat-Curing Silicone Rubber Compound – Potting & Encapsulation for Electronics with Flame Retardancy

  • Item Name: TSE3331

  • Manufacturer: Momentive Performance Materials

  • Technologies: Two-component, heat-curing liquid silicone rubber compound with thermal conductivity and flame retardancy

  • Color: Dark Gray (mixed)

  • Cure Type: Heat cure (100–200°C, rapid cure)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 12 months

1. Product Overview

TSE3331 is a two-component, heat-curing silicone rubber compound designed for potting and encapsulation where flame retardancy and thermal conductivity are critical. It provides excellent UL 94 V-0 flammability performance, stable dielectric properties across a broad temperature range, and superior thermal conductivity compared to conventional silicone encapsulants. Supplied in matched 1:1 kits by weight, it offers primerless adhesion to many substrates and an extended catalyzed room-temperature work life.


2. Applications

  • Potting and encapsulation of electronic components

  • Flame-retardant applications requiring UL 94 V-0 performance

  • Thermal management for power transistors, diodes, rectifiers, and heat-generating parts

  • Enclosed assemblies or deep-section encapsulation due to low shrinkage and non-exothermic cure

  • Industrial, automotive, and electronic systems operating from -55°C to 200°C

3. Typical Properties

Property Unit Value
Uncured Properties
Color TSE3331A: Dark Gray, TSE3331B: White
Viscosity cps 4100 (A), 3500 (B)
Uncured Properties (mixed 1:1)
Color Dark Gray
Consistency Easily Pourable
Viscosity cps 3500
Work Time @ 25°C hrs 8
Cured Properties (1 hr @ 120°C)
Specific Gravity 1.51
Hardness, JIS A 60
Tensile Strength kgf/cm² (psi) 30 (426)
Elongation % 50
Tear Strength kgf/cm (ppi) 3.4 (19)
Linear Shrinkage % 1.2
Flammability UL 94 V-0 (1.00mm / 0.040 in)
Electrical (1.9mm thick)
Dielectric Strength kV/mm (V/mil) 26 (661)
Dielectric Constant @ 60 Hz 3.4
Dissipation Factor @ 60 Hz 0.017
Volume Resistivity ohm·cm 2.0×10¹⁴
Thermal
Useful Temperature Range °C (°F) -55 to 200 (-67 to 392)
Thermal Conductivity W/m·K 0.63

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