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Thermal Management

Momentive TSE3280-G – Thermally Conductive Silicone Adhesive – Heat Cure Bonding for Electronics & Industrial Assemblies

  • Item Name: TSE3280-G

  • Manufacturer: Momentive Performance Materials

  • Technologies: One-component, heat-curing silicone adhesive with thermal conductivity and dielectric properties

  • Color: Grey

  • Cure Type: Heat cure (100°C – 4h, 125°C – 2h, 150°C – 1h)

  • Package Size: 200 g tubes, 333 ml cartridges, 2 kg cans, 25 kg drums

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

TSE3280-G is a one-component, medium-viscosity silicone adhesive that cures into an elastomer upon heating. It offers excellent thermal conductivity, good dielectric properties, and strong adhesion to a wide range of substrates without requiring a primer. Its formulation produces no cure by-products and exhibits low shrinkage, making it suitable for deep-section applications and use in enclosed assemblies. The product is non-corrosive and easy to handle, ensuring reliability in both industrial and electronic bonding applications.


2. Applications

  • Adhesive for electronic components and assemblies requiring thermal management.

  • Bonding to metals, glass, ceramics, and plastics without primer.

  • Encapsulating and sealing applications where dielectric properties are important.

3. Typical Properties

Property Before Mixing / Uncured After Mixing / Cured (1 hr at 150°C)
Colour Grey Grey
Viscosity (Pa·s) 60
Density (g/cm³) 2.10
Hardness (Type A) 62
Tensile Strength (MPa) 3.2
Elongation (%) 110
Adhesion Strength (MPa) 2.0
Dielectric Strength (kV/mm) 21
Dielectric Constant (60Hz) 4.3
Dissipation Factor (60Hz) 0.002
Volume Resistivity (Ω·cm) 2.5 × 10¹⁴
Thermal Conductivity (W/m·K) 0.88
Linear Expansion (1/K) 1.5 × 10⁻⁴

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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