Item Name: SilCool™ TSE3281
Manufacturer: Momentive Performance Materials
Technologies: One-component, heat-curable silicone adhesive
Color: Gray
Cure Type: Heat cure (120–150 °C)
Package Size: 1 kg can (case of 10), 25 kg pail
Shelf Life: Contact to Techniq VN for details.
SilCool TSE3281 is a one-component, heat-curable silicone adhesive designed for thermally conductive applications. It cures rapidly under heat and adheres strongly to a wide variety of substrates without the need for a primer. The product offers excellent thermal conductivity, high adhesive strength, and electrical insulation properties, making it suitable for bonding and sealing heat-generating electronic components.
Sealing and bonding for thermally conductive applications such as heat-generating elements, regulators, rectifiers, and thyristors.
Adhesive for metals, plastics, rubber, and inorganic substrates requiring thermal transfer.
| Property | Uncured | Cured (1h @ 150°C) |
|---|---|---|
| Appearance | Flowable paste, gray | Elastic rubber |
| Viscosity (Pa·s, 23°C) | 60 | – |
| Density (g/cm³) | – | 2.70 |
| Hardness (Type A) | – | 84 |
| Tensile Strength (MPa) | – | 4.5 |
| Elongation (%) | – | 50 |
| Adhesive Strength (MPa, Al lap shear) | – | 2.5 |
| Linear Expansion (1/K) | – | 1.4 × 10⁻⁴ |
| Thermal Conductivity (W/m·K) | – | 1.7 |
| Thermal Resistance (BLT: 50µm) | – | 35 |
| Volume Resistivity (Ω·cm) | – | 4.8 × 10¹⁴ |
| Dielectric Strength (kV/mm) | – | 15 |
| Dielectric Constant (60Hz) | – | 5.2 |
| Dissipation Factor (60Hz) | – | 0.002 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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