• Item Name: Techspray® No-Clean Desoldering Braid
• Manufacturer: Techspray® / ITW Contamination Control BV
• Technologies: No-clean flux coated copper braid
• Color: White, Yellow, Green, Blue, Brown, Red (depending on braid size)
• Cure Type: Not applicable
• Package Size: 5 ft to 100 ft spools (ESD-safe options available); Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
Techspray® No-Clean Desoldering Braid is a rosin flux-coated braid designed to remove solder efficiently while leaving no ionic residues that can cause dendrite formation. This prevents latent electrical failures and improves long-term reliability of PCBs. Anti-static spools are available to protect sensitive electronic components.
High-volume PCB production and repair
Desoldering with minimal residue
Safe use on sensitive electronic components
| Property | Specification / Value |
|---|---|
| Flux Type | No-clean, rosin-coated |
| Residue | Clear, non-reactive, avoids dendrites |
| Exceeds | MIL-F-14256, NASA NHB 5300, NASA NPC 200-4, NASA SP5002, IPC Standard-J-STD-004 |
| Anti-Static | Yes (on marked spools) |
| Color Coding | #1 White, #2 Yellow, #3 Green, #4 Blue, #5 Brown, #6 Red |
| Width Range | 0.035 in (0.9 mm) to 0.193 in (4.9 mm) |
| Length Options | 5 ft (1.5 m) – 100 ft (30.5 m) depending on size and part# |
Leaves no ionic residue, preventing dendrite failures
Fast and clean solder wicking action
Meets/exceeds key military and NASA standards
Anti-static options for sensitive components
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.