Item Name: DOWSIL™ TC-8225 Thermally Conductive Gap Filler
Manufacturer: Dow
Technologies: Two-part silicone gel matrix with glass bead fillers
Color: Part A – White; Part B – Blue
Cure Type: Room temperature or heat-accelerated addition cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 10 months
DOWSIL™ TC-8225 is a two-part silicone-based thermally conductive gap filler with a thermal conductivity of 2.7 W/m·K. It cures at room temperature or under heat to form a soft, compressible elastomer designed for long-term reliability in thermal management. The product withstands continuous operation up to 150°C and short-term exposure up to 200°C. Incorporating glass beads (~180 µm) for controlled thickness, it provides reliable gap filling, dielectric insulation, stress relief, and environmental protection. Its stable performance across temperature cycling makes it ideal for high-demand electronic applications.
Thermal management for PCB system assemblies
Effective heat dissipation between PCB devices and aluminum housings
Designed for automated dispensing with meter-mix equipment
Suitable for devices requiring shock absorption, vibration damping, and insulation
| Property | Condition | Value |
|---|---|---|
| Part Type | – | Two-part (A+B, 1:1 mix) |
| Color | A: White / B: Blue | |
| Viscosity | Part A / Part B / Mixed | 209 / 195 / 200 Pa·s |
| Thixotropic Index | Mixed | 4.2 |
| Specific Gravity | Mixed | 2.9 |
| Working Time | 25°C (Viscosity after 1h) | 490 Pa·s |
| Cure Time | 25°C / 80°C | 120 min / 10 min |
| Hardness | Shore 00 | 55 |
| Thermal Conductivity | Transient Method | 2.7 W/m·K |
| Volume Resistivity | – | 2.4 × 10¹⁴ Ω·cm |
| Dielectric Strength | At 280 μm | 44 kV/mm |
| Operating Temp. Range | – | -45 to 150°C (200°C short term) |
| Shelf Life | 25°C | 300 days |
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