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DOWSIL™ TC-3035 S – One-part ultra soft thermal gel for smartphone CPU, memory, and PCBA thermal management

  • Item Name: DOWSIL™ TC-3035 S Soft Thermal Gel

  • Manufacturer: The Dow Chemical Company

  • Technologies: One-part heat-cure silicone-based ultra soft thermal gel

  • Color: Pink

  • Cure Type: Heat cure at 80°C for 30 min

  • Package Size: 300 ml Al cartridge

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

DOWSIL™ TC-3035 S is a one-part, ultra-soft silicone-based thermal gel. It cures at 80°C in 30 minutes to form a low-modulus gel suitable for thermal transfer, stress relief, and shock damping. The material offers excellent thermal performance, long working time at room temperature, and resistance to heat, humidity, and harsh environments. It can be printed or dispensed in various thicknesses and shapes, maintaining consistent thermal management properties.


2. Applications

  • Thermal interface material for smartphone CPUs and memory chips

  • General thermal management of PCBA assemblies

  • Dispense or screen-printable for custom thicknesses and shapes

Application Methods: Auto/manual dispensing or screenprinting.

3. Typical Properties

Property Unit Result
One or Two-part One
Color Pink
Viscosity (10 s⁻¹) Pa·s 200
Extrusion Rate g/min 100
Curing Time at 80°C min 30
Specific Gravity (Cured) g/cm³ 3.2
Working Time at 25°C days >30
Dielectric Strength kV/mm 14
Cured Hardness Shore OOO 65
Volume Resistivity ohm·cm 6.0 × 10¹³
Thermal Conductivity W/m·K 4.0
Bond Line Thickness (BLT) μm 90
Storage Temperature °C <10
Non-Volatile Content (NVC) % 99.9

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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