Applications

BERGQUIST LIQUI BOND TLB SA3500 – Silicone Adhesive – Thermal management for power supplies, PCBAs, housings

  • Item Name: BERGQUIST LIQUI BOND TLB SA3500 (Also known as BERGQUIST LIQUI-BOND SA 3505)

  • Manufacturer: Henkel

  • Technologies: Thermally conductive, two-part liquid silicone adhesive

  • Color: Part A – Brown, Part B – Light gray, Mixed – Light brown

  • Cure Type: Heat cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 6 months

1. Product Overview

BERGQUIST LIQUI-BOND TLB SA3500 is a thermally conductive, two-part liquid silicone adhesive formulated for thermal management. With a thermal conductivity of 3.5 W/m·K, it delivers high bonding strength, reliability under severe environmental conditions, and eliminates the need for mechanical fasteners. Once heat-cured, it forms a robust elastomer with mild elasticity, reducing CTE stresses during thermal cycling. The adhesive can be dispensed in varied thicknesses and is available with optional glass spacer beads for consistent bond lines and dielectric integrity.


2. Applications

  • Power supplies requiring efficient thermal transfer.

  • Discrete components to heat spreaders for structural and thermal bonding.

  • PCBA-to-housing assemblies with thermal management needs.

3. Typical Properties

Property Still Not Mixed (Uncured) After Mixed / Cured
Appearance Part A: Brown / Part B: Light gray Mixed: Light brown
Mix Ratio 1:1
Viscosity (ASTM D5099) Part A: 45 Pa·s / Part B: 30 Pa·s
Density (ASTM D792) 2.9 g/cc
Pot Life @ 25 °C 240 min
Shelf Life 6 months @ 25 °C
Cure Schedule 20 min @ 125 °C or 10 min @ 150 °C
Hardness (ASTM D2240) 90 Shore A
Dielectric Strength (ASTM D149) 10,000 V/mm
Dielectric Constant (ASTM D150 @1kHz) 6.9
Volume Resistivity (ASTM D257) 1×10¹⁰ Ω·m
Thermal Conductivity (ASTM D5470) 3.5 W/m·K
Shear Strength (ASTM D1002) 3.15 MPa (450 psi)
Operating Temperature -60 to 200 °C
UL Flammability UL 94 V-0

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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