Applications

BERGQUIST LIQUI BOND TLB SA1800 – Silicone Adhesive – Thermal management for PCBs, heat spreaders, housings

  • Item Name: BERGQUIST LIQUI BOND TLB SA1800

  • Manufacturer: Henkel

  • Technologies: Thermally conductive, one-part liquid silicone adhesive

  • Color: Black

  • Cure Type: Heat cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 6 months

1. Product Overview

BERGQUIST LIQUI-BOND TLB SA1800 is a thermally conductive, one-part liquid silicone adhesive designed for thermal management. It provides a thermal conductivity of 1.8 W/m·K, strong environmental durability, and eliminates the need for mechanical fasteners. With its low viscosity, the adhesive supports efficient screen or stencil application and automated dispensing. Upon heat cure, it forms a solid elastomer with mild elasticity to mitigate CTE stresses. Refrigerated storage at 10 °C is required to maintain a six-month shelf life.


2. Applications

  • PCB assembly to housing connections.

  • Discrete component to heat spreader bonding.

3. Typical Properties

Property Still Not Mixed (Uncured) After Cured
Appearance Black
Technology Silicone
Viscosity (ASTM D2196, 25 °C) 125,000 mPa·s
Density (ASTM D792) 2.8 g/cc
Pot Life @ 25 °C 10 h
Shelf Life 6 months @ 10 °C
Cure Schedule 20 min @ 125 °C or 10 min @ 150 °C
Hardness (ASTM D2240) 80 Shore A
Dielectric Strength (ASTM D149) 10,000 V/mm
Dielectric Constant (ASTM D150 @1kHz) 6.0
Volume Resistivity (ASTM D257) 1×10¹⁰ Ω·m
Thermal Conductivity (ASTM D5470) 1.8 W/m·K
Shear Strength (ASTM D1002) 1.4 MPa (200 psi)
Operating Temperature -60 to 200 °C
UL Flammability UL 94 V-0

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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