Item Name: LOCTITE® ECI 8090
Manufacturer: Henkel
Technologies: Thermoplastic, Positive Temperature Coefficient (PTC) carbon conductive ink
Color: Black paste
Cure Type: Hot air drying or infrared
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE® ECI 8090 is a carbon-filled thermoplastic conductive ink designed for producing low-voltage (<50 V) self-regulating heating elements. This black paste is screen printable, flexible, and compatible with PET, PEN, and PI substrates. With a self-regulating temperature of approximately 85°C, it provides rapid heating and a well-defined cut-off without external control systems. The ink is compatible with silver ink LOCTITE® ECI 1010 and can be blended with non-conductive ink LOCTITE® NCI 8092 to adjust resistance, offering design flexibility for heating elements in electronic applications.
Self-regulating heating elements on flexible foils
Printed heaters for electronic devices and films
Low-voltage heating systems requiring ~85°C cut-off
Hybrid heating circuits combining silver and carbon inks
Adjustable resistance heating designs using NCI 8092 blending
| Category | Property | Value |
|---|---|---|
| Undried | Technology | Thermoplastic |
| Appearance | Black paste | |
| Filler Type | Carbon | |
| Solid Content | 39 % | |
| Density | 1.0 g/cm³ | |
| Viscosity (25°C, shear rate 1.5 s⁻¹) | 100,000 mPa·s | |
| Thixotropic Index (1.5/15 s⁻¹) | 6.0 | |
| Theoretical Coverage (10 µm film) | 38 m²/kg | |
| Shelf Life (8–28°C) | 365 days | |
| Operating Temperature (max) | 95 °C | |
| Drying Cycle | 10 min @ 140°C | |
| Dried | Adhesion on PET | Grade 5B (ASTM 3359) |
| Sheet Resistance (25 µm film, 10 min @ 140°C) | 1,100 Ω/sq | |
| PTC Ratio | 8.2 | |
| Self-Regulation Temperature | ~85 °C |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.