Item Name: LOCTITE® UK 3364™
Manufacturer: Henkel
Technologies: Two-component urethane (polyisocyanate-based)
Color: Resin – Dark brown liquid; Hardener – Black liquid; Cured – Black solid
Cure Type: Room temperature cure (heat accelerates)
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
LOCTITE® UK 3364™ is a rigid two-component urethane adhesive composed of polyisocyanate resin and hardener. It features low viscosity, rapid room-temperature curing, and high flame resistance. Supplied in a convenient two-part system, it is classified by UL and ULC for plastics and components, ensuring reliability in demanding environments.
Designed for potting and bonding applications, LOCTITE® UK 3364™ provides structural integrity for electrical, mechanical, and composite assemblies. It is particularly suitable for use where flame resistance, fast curing, and high mechanical strength are required.
| Condition | Property | Value |
|---|---|---|
| Uncured – Resin | Specific Gravity (25 °C) | 1.49 |
| Viscosity (25 °C, shear rate 100 s⁻¹) | 13,365 mPa·s | |
| Uncured – Hardener | Specific Gravity (25 °C) | 1.25 |
| Viscosity (25 °C, shear rate 100 s⁻¹) | 850 mPa·s | |
| Mixed | Specific Gravity (25 °C) | 1.31 |
| Gel Time (25 °C) | 60–120 s | |
| Tack Free Time (25 °C) | 330–360 s | |
| Cured (7 days @ 22 °C) | Shore Hardness (D) | ≥80 |
| Glass Transition Temperature (Tg) | 50 °C | |
| Tensile Strength | 26.7 N/mm² (3,870 psi) | |
| Young’s Modulus | 2,320 N/mm² (336,400 psi) | |
| Elongation at Break | 1.7 % | |
| Dielectric Breakdown Strength | 32 kV/mm | |
| Volume Resistivity | 2.3 × 10¹⁵ Ω·cm |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.