Applications

HYDRON® SE 230A – Alkaline Cleaner – Semiconductor Electronics Defluxing, Wafer Bumping, Power Modules, Leadframes

  • Item Name: HYDRON® SE 230A

  • Manufacturer: ZESTRON

  • Soil/Flux Compatibility: Rosin, Resin, No Clean (NC), Mildly Activated (RMA), Activated (RA), Water Soluble (WS), Synthetically Activated (SA)

  • Chemistry/Key flags: Water-based, single-phase, biodegradable, halogen-free, low surface tension, high material compatibility, lead-free solder compatible

  • Process/Equipment: Dip tank, ultrasonic (US), spray under immersion (SUI), wafer processing equipment, hot air or circulating air drying

  • Package Size: 1 L, 5 L, 25 L, 200 L

  • Shelf Life: 5 years

1. Product Overview
HYDRON® SE 230A is a water-based, single-phase alkaline defluxing agent, purpose-built for dip tank cleaning processes in semiconductor electronics. It delivers highly reliable flux residue removal from components such as leadframes, discrete devices, power modules, LEDs, flip chips, CMOS, and wafers after bumping. The cleaner ensures stainless, activated copper surfaces, excellent deoxidation, and superior penetration into low stand-off areas, making it ideal for subsequent processes like wire bonding, molding, and adhesive bonding. With no flash point, low odor, and full RoHS/REACH compliance, it represents a safe, environmentally friendly cleaning solution with long storage stability.


2. Applications

  • Flux residue removal from semiconductor devices including power modules, leadframes, discrete components, LEDs, flip chips, and CMOS.

  • Effective deoxidation of copper substrates for reliable wire bonding, molding, and adhesive processes.

  • Post-wafer bumping defluxing in both single and batch wafer processing equipment.

  • Cleaning of assemblies requiring compliance with IPC-A-610, J-STD-001, IPC-5704, and IPC-Hdbk-65B standards.

  • Suitable for cleaning lead-free solder pastes and minimizing particle contamination in sensitive assemblies.

3. Typical Properties – Specifications

  • Appearance: Water-based, single-phase liquid

  • Density (20°C): 0.99 g/cm³

  • Surface tension (25°C): 27.7 mN/m

  • Boiling point: > 98°C

  • Flash point: None until boiling

  • pH (10 g/l H₂O): 9.6

  • Vapor pressure (20°C): ~20 mbar

  • Cleaning temperature: 40–60°C

  • Application concentration: 15–30% in DI-water

  • Solubility: Fully soluble in water

  • Compliance: RoHS 1/2/3, WEEE, REACH, lead-free suitable

  • Packaging: 1 L, 5 L, 25 L, 200 L

  • Shelf life: Minimum 5 years in sealed containers at 5–30°C

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