Item Number: CV-5210-IOT (CV-5210 station + CV-IOT module)
Manufacturer: Metcal (OK International)
Application: Industry 4.0 soldering with advanced traceability, process monitoring, and production analytics
Key Technology: ConnectionValidation® IMC, SmartHeat® induction, Chip-in-Cartridge, IoT gateway with real-time reporting
Heating Method: 80 W RF SmartHeat® induction, 13.56 MHz, power-on-demand, stable idle temperature
Compatibility: CV-5200 handpieces, TipSaver™ workstands, USB/Ethernet connectivity, Windows 10 system integration
Specifications: 100–240 VAC, 125 W, 121×130×235 mm, 3.35 kg, TFT LCD display, CE/TUV certified, IoT module 70×55 mm, 5 V/0.25 A
1. Product Overview
The Metcal CV-5210-IOT combines the advanced CV-5210 ConnectionValidation® Soldering System with the CV-IOT Gateway Module, raising process control and traceability standards for Industry 4.0 environments. Featuring SmartHeat® power-on-demand technology, Chip-in-Cartridge thermal accuracy, and patented IMC formation monitoring, the system ensures reliable solder joint quality. The integrated 2.8-inch TFT touchscreen, real-time power graph, and USB connectivity provide intuitive operation, while the CV-IOT module enables full network integration, dynamic data capture, and global access to soldering analytics.
2. Applications
This system is designed for electronics manufacturing and high-reliability industries where process traceability and quality assurance are critical. By offering live monitoring of solder events, tip usage, power data, and production status, it supports Industry 4.0 implementation, audit readiness, and enhanced production floor management. Its versatility makes it suitable for OEMs, EMS providers, and sectors demanding IPC J-STD-001 compliance.
3. Typical Properties – Specifications
CV-5210 Station
Input Voltage: 100–240 VAC, 50/60 Hz
Power: 125 W (80 W max output, 13.56 MHz induction)
Temperature Accuracy: Meets/exceeds IPC J-STD-001
Idle Temperature Stability: ±1.1 °C
Dimensions: 121 × 130 × 235 mm; Weight: 3.35 kg
Display: 2.8” TFT LCD, 320×240 RGB
Certifications: CE, TÜV
Tip-to-Ground Potential: <2 mV; Resistance: <2 Ω
CV-IOT Module
Dimensions: 70 × 55 mm, 8-layer PCB
CPU: MCIMX6; DDR3: 256 MB (up to 2 GB)
NAND Flash: 256 MB (expandable to 1 GB)
Power: 5 V/1 A (consumption 0.25 A)
Interfaces: Ethernet 10/100 Mbps, USB Host, Micro USB Device
Operating Temp: -40 °C to 85 °C (EU); 0 °C to 70 °C (NA)
Applications: Industry 4.0 IoT integration
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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