• Item Name: LOCTITE® DSP 190024/S
• Manufacturer: Henkel
• Technologies: Acrylate
• Color: Bone-white to beige translucent paste
• Cure Type: Ultraviolet (UV) light / Visible light
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE DSP 190024/S is a one-component, UV/visible light-curable acrylate adhesive supplied as a bone-white to beige translucent paste. It is thixotropic, medium-viscosity, and designed for high-throughput electronic assembly. The adhesive cures rapidly under UV or visible light without requiring post-curing, providing strong adhesion to a variety of substrates while minimizing migration after application.
Edgebond adhesive for reinforcing electronic components on PCBs
High-speed production environments requiring fast UV cure and reliability
Suitable for assemblies needing good adhesion to multiple substrates and controlled flow properties
| Property | Still Not Mixed (Uncured) | After Mixed / Cured |
|---|---|---|
| Appearance | Bone-white to beige translucent paste | Solid cured adhesive |
| Viscosity (mPa·s, 25°C) | 44,000 | — |
| Specific Gravity | 1.1 | — |
| Cure Method | UV / Visible light | — |
| Light Source | Zeta 7411 UV Flood, 365 nm | — |
| Cure Time (80 s @ 30 mW/cm²) | — | Fully cured |
| Fixture Time (≤10 s @ 6 mW/cm², 365 nm) | — | 0.1 N/mm² shear |
| Glass Transition Temp (°C) | — | Tg1: -39, Tg2: 77 |
| Coefficient of Thermal Expansion (µm/m/K) | — | 66 / 151 / 217 |
| Thermal Conductivity (W/m·K) | — | 0.17 |
| Elongation (%) | — | 186 |
| Tensile Modulus (MPa) | — | 175 |
| Tensile Strength (MPa) | — | 15.6 |
| Electrical – Dielectric Constant | — | 4.58 (100 Hz) → 4.31 (1 MHz) |
| Electrical – Dissipation Factor | — | 0.032 (100 Hz) → 0.034 (1 MHz) |
| Volume Resistivity (ohm·cm) | — | 1.13 × 10¹⁷ |
| Surface Resistivity (ohm) | — | 1.53 × 10¹⁶ |
| Shear Strength (Polycarbonate-PCB, MPa) | — | 12.56 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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