Item Name: LOCTITE® ECCOBOND EN 3847
Manufacturer: Henkel
Technologies: Acrylate
Color: Black
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 6 months
LOCTITE® ECCOBOND EN 3847 is a black, acrylate-based, one-component adhesive designed for electronic encapsulation. It cures quickly at moderate heat, delivering low glass transition temperature, low modulus, flexibility, and reworkability. Once cured, it ensures reliable protection, durability, and performance under challenging environmental conditions such as temperature, humidity, and electrical bias.
Encapsulation of components on PCBs (Printed Circuit Boards) and FPCBs (Flexible Printed Circuit Boards).
Circuit board encapsulant requiring flexibility and reworkability.
Provides physical and electronic protection in sensitive assemblies.
| Condition | Property | Value |
|---|---|---|
| Still Not Mixed (Uncured) | Viscosity @ 25°C, 20 rpm | 3,876 mPa·s |
| Thixotropic index (2/20 rpm) | 3.75 | |
| Density | 1 g/cc | |
| Pot life @ 25°C | 3 days | |
| Shelf life @ -20°C | 180 days | |
| Curing Performance | Recommended cure | ≥10 min @ 130°C |
| After Mixed (Cured) | Hardness | Shore A 71 |
| Glass transition temperature (Tg) | 10 °C | |
| Elongation @ 25°C | 55 % | |
| Storage modulus @ 25°C | 117 N/mm² |
This material is optimized for flexible encapsulation where moderate curing conditions and reworkability are critical, offering a balance of mechanical strength and low-stress protection.
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